Sockel für ICs, Transistoren

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1109704

1109704

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
2,769 -

RFQ

1109704

Datenblatt

- - Active - - - - - - - - - - - - - -
1110134

1110134

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,937 -

RFQ

1110134

Datenblatt

- - Active - - - - - - - - - - - - - -
2485-111-13

2485-111-13

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,379 -

RFQ

2485-111-13

Datenblatt

- - Active - - - - - - - - - - - - - -
2552-111-13

2552-111-13

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,084 -

RFQ

2552-111-13

Datenblatt

- - Active - - - - - - - - - - - - - -
34-6823-90

34-6823-90

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,285 -

RFQ

34-6823-90

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
34-6823-90T

34-6823-90T

CONN IC DIP SOCKET 34POS TIN

Aries Electronics
3,170 -

RFQ

34-6823-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
4847-111-13

4847-111-13

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,996 -

RFQ

4847-111-13

Datenblatt

- - Active - - - - - - - - - - - - - -
1105572

1105572

800 VERTISOCKET VERTICAL MOUNT

Aries Electronics
2,469 -

RFQ

1105572

Datenblatt

- - Active - - - - - - - - - - - - - -
1108680

1108680

800 VERTISOCKET VERTICAL MOUNT

Aries Electronics
2,357 -

RFQ

1108680

Datenblatt

- - Active - - - - - - - - - - - - - -
1110137

1110137

800 VERTISOCKET VERTICAL MOUNT

Aries Electronics
2,378 -

RFQ

1110137

Datenblatt

- - Active - - - - - - - - - - - - - -
1110221

1110221

800 VERTISOCKET VERTICAL MOUNT

Aries Electronics
2,819 -

RFQ

1110221

Datenblatt

- - Active - - - - - - - - - - - - - -
1106275-16

1106275-16

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
2,959 -

RFQ

1106275-16

Datenblatt

- - Active - - - - - - - - - - - - - -
1106275-20

1106275-20

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
2,342 -

RFQ

1106275-20

Datenblatt

- - Active - - - - - - - - - - - - - -
1109785

1109785

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
2,829 -

RFQ

1109785

Datenblatt

- - Active - - - - - - - - - - - - - -
34-6820-90C

34-6820-90C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,121 -

RFQ

34-6820-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-6822-90C

34-6822-90C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
3,120 -

RFQ

34-6822-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-6823-90C

34-6823-90C

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics
2,234 -

RFQ

34-6823-90C

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-81000-10

14-81000-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
3,813 -

RFQ

14-81000-10

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-81100-10

14-81100-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
2,361 -

RFQ

14-81100-10

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-81187-10

14-81187-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics
2,366 -

RFQ

14-81187-10

Datenblatt

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Record«Prev1... 208209210211212213214215...217Next»
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

Benutzer