Sockel für ICs, Transistoren

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1109681-628

1109681-628

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,131 -

RFQ

1109681-628

Datenblatt

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-632

1109681-632

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,151 -

RFQ

1109681-632

Datenblatt

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109681-648

1109681-648

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics
2,361 -

RFQ

1109681-648

Datenblatt

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Through Hole Spacer Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
257-PGG20012-10

257-PGG20012-10

CONN SOCKET PGA GOLD

Aries Electronics
2,915 -

RFQ

- - Active - - - - - - - - - - - - - -
Total 4324 Record«Prev1... 213214215216217Next»
Daily average RFQ Volume
1500+ Täglicher Durchschnitts-RFQ
Standard Product Unit
20,000.000 Standardprodukteinheit
Worldwide Manufacturers
1800+ Weltweite Hersteller
In-stock Warehouse
15,000+ Lagerbestand
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