Sockel für ICs, Transistoren

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
36-7XXXX-10

36-7XXXX-10

CONN SOCKET SIP 36POS TIN

Aries Electronics
3,759 -

RFQ

36-7XXXX-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 36 (1 x 36) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
37-7XXXX-10

37-7XXXX-10

CONN SOCKET SIP 37POS TIN

Aries Electronics
3,696 -

RFQ

37-7XXXX-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 37 (1 x 37) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-7XXXX-10

38-7XXXX-10

CONN SOCKET SIP 38POS TIN

Aries Electronics
3,204 -

RFQ

38-7XXXX-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 38 (1 x 38) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
39-7XXXX-10

39-7XXXX-10

CONN SOCKET SIP 39POS TIN

Aries Electronics
2,930 -

RFQ

39-7XXXX-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 39 (1 x 39) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-7XXXX-10

40-7XXXX-10

CONN SOCKET SIP 40POS TIN

Aries Electronics
3,041 -

RFQ

40-7XXXX-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 40 (1 x 40) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-513-10T

16-513-10T

CONN SOCKET SIP 16POS GOLD

Aries Electronics
2,413 -

RFQ

16-513-10T

Datenblatt

Bulk 0513 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109011

1109011

SERIES 513 LO-PRO W/SOLDER TAIL

Aries Electronics
2,942 -

RFQ

1109011

Datenblatt

- - Active - - - - - - - - - - - - - -
1109294

1109294

SERIES 513 LO-PRO W/SOLDER TAIL

Aries Electronics
3,472 -

RFQ

1109294

Datenblatt

- - Active - - - - - - - - - - - - - -
08-6513-11H

08-6513-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics
2,532 -

RFQ

08-6513-11H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1108831

1108831

518 OPN FRM COLLET SCKT SLDR TAI

Aries Electronics
2,243 -

RFQ

1108831

Datenblatt

- - Active - - - - - - - - - - - - - -
4236-118-14

4236-118-14

518 OPN FRM COLLET SCKT SLDR TAI

Aries Electronics
3,621 -

RFQ

4236-118-14

Datenblatt

- - Active - - - - - - - - - - - - - -
1107425

1107425

508 OPN FRM COLLET SCKT WIRE WRP

Aries Electronics
3,378 -

RFQ

- - Active - - - - - - - - - - - - - -
1108594

1108594

508 OPN FRM COLLET SCKT WIRE WRP

Aries Electronics
2,024 -

RFQ

1108594

Datenblatt

- - Active - - - - - - - - - - - - - -
29-0508-20

29-0508-20

X508 SMD SNG/DUAL SCKT WIRE WRAP

Aries Electronics
3,987 -

RFQ

29-0508-20

Datenblatt

- 505 Active - - - - - - - - - - - - - -
2357-108-12

2357-108-12

EJECT-A-DP LCK/EJCT SCKT SLDR TL

Aries Electronics
3,862 -

RFQ

2357-108-12

Datenblatt

- - Active - - - - - - - - - - - - - -
5679-107-12

5679-107-12

518 OPN FRM CAP SOCKET SLDR TAIL

Aries Electronics
2,942 -

RFQ

5679-107-12

Datenblatt

- - Active - - - - - - - - - - - - - -
7340-140-12

7340-140-12

518 OPN FRM CAP SOCKET SLDR TAIL

Aries Electronics
3,264 -

RFQ

7340-140-12

Datenblatt

- - Active - - - - - - - - - - - - - -
40-6518-101T

40-6518-101T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,497 -

RFQ

40-6518-101T

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1108252

1108252

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,692 -

RFQ

1108252

Datenblatt

- - Active - - - - - - - - - - - - - -
1109124

1109124

800 VERTISOCKET HORIZONTAL MOUNT

Aries Electronics
3,969 -

RFQ

1109124

Datenblatt

- - Active - - - - - - - - - - - - - -
Total 4324 Record«Prev1... 207208209210211212213214...217Next»
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

Benutzer