AMD Xilinx XC7Z030-1FBG676C

Teilenummer
XC7Z030-1FBG676C
Hersteller
AMD Xilinx
Kategorie:
Embedded – System-on-Chip (SoC)
Verpackung
676-BBGA, FCBGA
Datenblatt
Fudong Communication (shenzhen) Group Co., Ltd.XC7Z030-1FBG676C.pdf
Beschreibung
IC SOC CORTEX-A9 667MHZ 676FCBGA
Menge

Stückpreis$0

Gesamtpreis$0

Zahlung
payment
Versand
payment

Product details

1. How to order XC7Z030-1FBG676C on Fudong Communication (Shenzhen) Group Co., Ltd.?

Currently, Fudong Communication (Shenzhen) Group Co., Ltd. only provide peer-to-peer order processing. While you submit the RFQ, our professional agent will contact you with the competitive prices in the global market, and our agent will prompt you to finish the order if you accept our offers.

2. How does Fudong Communication (Shenzhen) Group Co., Ltd. guarantee that XC7Z030-1FBG676C is from the original manufacturer or authorized agents?

We have a professional and experienced quality control team to strictly verify and test the XC7Z030-1FBG676C. All suppliers must pass our qualification reviews before they can publish their products including XC7Z030-1FBG676C on Fudong Communication (Shenzhen) Group Co., Ltd.; we pay more attention to the channels and quality of XC7Z030-1FBG676C products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the XC7Z030-1FBG676C price and inventory displayed accurate?

The price and inventory of XC7Z030-1FBG676C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

Wire Transfer, PayPal, Alipay, Wechat, Credit Card, Western Union, MoneyGram, and Escrow are all acceptable.

Warm Tips: Some orders in certain payment forms may require handling fee.

5. How is the shipping arranged?

Customers can choose industry-leading freight companies, including DHL, UPS, FedEx, TNT, and Registered Mail. Shipping insurance is also available.

Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XC7Z030-1FBG676C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XC7Z030-1FBG676C we delivered, we will accept the replacement or return of the XC7Z030-1FBG676C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XC7Z030-1FBG676C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations

7.How to contact us to get technical supports, such as XC7Z030-1FBG676C pin diagram, XC7Z030-1FBG676C datasheet?

If you need any after-sales service, please do not hesitate to contact us.

Bild XC7Z007S-1CLG400C XC7Z010-1CLG400C XC7Z007S-2CLG400E XC7Z010-2CLG400I XC7Z014S-1CLG400I
Teilenummer XC7Z007S-1CLG400C XC7Z010-1CLG400C XC7Z007S-2CLG400E XC7Z010-2CLG400I XC7Z014S-1CLG400I
Hersteller AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Package/Case 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA 676-BBGA, FCBGA
Packaging Tray Tray Tray Tray Tray
Series Zynq®-7000 Zynq®-7000 Zynq®-7000 Zynq®-7000 Zynq®-7000
ProductStatus Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
FlashSize - - - - -
RAMSize 256KB 256KB 256KB 256KB 256KB
Peripherals DMA DMA DMA DMA DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz 667MHz 667MHz 667MHz 667MHz
PrimaryAttributes Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells Kintex™-7 FPGA, 125K Logic Cells
OperatingTemperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)

XC7Z030-1FBG676C Relevante Informationen

Die folgenden Teile sind enthalten "XC7Z030-1FBG676C" ISSI, Integrated Silicon Solutions Inc. XC7Z030-1FBG676C.

  • Teilenummer
  • Hersteller
  • Verpackung
  • Beschreibung
Auf Lager:3,312

Bitte senden Sie eine RFQ.

Bitte senden Sie eine RFQ. Wir antworten umgehend.

Teilenummer
Menge
Preis
Kontakte
Firma
E-Mail
Inhalt
Auf Lager:3,312
Menge Stückpreis Gesamtpreis
RFQ Zur RFQ-Liste hinzufügen
SC-20100S-A

SC-20100S-A

GHI Electronics, LLC

M2S050-FGG484

M2S050-FGG484

Microchip Technology

MAX32655GXG+

MAX32655GXG+

Analog Devices Inc./Maxim Integrated

30SOC-SC-539

30SOC-SC-539

GHI Electronics, LLC

M2S050T-FGG896

M2S050T-FGG896

Microchip Technology

QN9021/D

QN9021/D

NXP USA Inc.

1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

Benutzer