Texas Instruments BBN6203BGNY30C

Teilenummer
BBN6203BGNY30C
Hersteller
Texas Instruments
Kategorie:
Embedded – DSP (Digitale Signalprozessoren)
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Datenblatt
BBN6203BGNY30C.pdf
Beschreibung
IC DSP FIXED POINT 384CSP
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1. How to order BBN6203BGNY30C on Fudong Communication (Shenzhen) Group Co., Ltd.?

Currently, Fudong Communication (Shenzhen) Group Co., Ltd. only provide peer-to-peer order processing. While you submit the RFQ, our professional agent will contact you with the competitive prices in the global market, and our agent will prompt you to finish the order if you accept our offers.

2. How does Fudong Communication (Shenzhen) Group Co., Ltd. guarantee that BBN6203BGNY30C is from the original manufacturer or authorized agents?

We have a professional and experienced quality control team to strictly verify and test the BBN6203BGNY30C. All suppliers must pass our qualification reviews before they can publish their products including BBN6203BGNY30C on Fudong Communication (Shenzhen) Group Co., Ltd.; we pay more attention to the channels and quality of BBN6203BGNY30C products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

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The price and inventory of BBN6203BGNY30C fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of BBN6203BGNY30C?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the BBN6203BGNY30C we delivered, we will accept the replacement or return of the BBN6203BGNY30C only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of BBN6203BGNY30C.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations

7.How to contact us to get technical supports, such as BBN6203BGNY30C pin diagram, BBN6203BGNY30C datasheet?

If you need any after-sales service, please do not hesitate to contact us.

Bild TMS32C6203BGNZA250 TMS320C6211GFN167 TMS320C6412GNZ500 TMS320C6412GDK500 TMS320C6211BGFN180
Teilenummer TMS32C6203BGNZA250 TMS320C6211GFN167 TMS320C6412GNZ500 TMS320C6412GDK500 TMS320C6211BGFN180
Hersteller Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Package/Case
Packaging Tray Tray Tray Tray Tray
Series TMS320C62x TMS320C62x TMS320C62x TMS320C62x TMS320C62x
ProductStatus Not For New Designs Not For New Designs Not For New Designs Not For New Designs Not For New Designs
Type Fixed Point Fixed Point Fixed Point Fixed Point Fixed Point
Interface McBSP McBSP McBSP McBSP McBSP
ClockRate 300MHz 300MHz 300MHz 300MHz 300MHz
Non-VolatileMemory External External External External External
On-ChipRAM 896kB 896kB 896kB 896kB 896kB
Voltage-I/O 3.30V 3.30V 3.30V 3.30V 3.30V
Voltage-Core 1.50V 1.50V 1.50V 1.50V 1.50V
OperatingTemperature 0°C ~ 90°C (TC) 0°C ~ 90°C (TC) 0°C ~ 90°C (TC) 0°C ~ 90°C (TC) 0°C ~ 90°C (TC)
MountingType Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount

BBN6203BGNY30C Relevante Informationen

Die folgenden Teile sind enthalten "BBN6203BGNY30C" ISSI, Integrated Silicon Solutions Inc. BBN6203BGNY30C.

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