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| Foto: | Hersteller-Teilenummer | Verfügbarkeit | Preis | Menge | Datenblatt | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC191LTA35SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,023 | - |
RFQ |
Datenblatt |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 4 | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SMD2165-25000SOLDER SPHERES SN63/PB37 .012 D Chip Quik Inc. |
3,512 | - |
RFQ |
Datenblatt |
Jar | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.012 (0.31mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD2060-25000SOLDER SPHERES SAC305 .030 DIAM Chip Quik Inc. |
3,993 | - |
RFQ |
Datenblatt |
Jar | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.030 (0.76mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2055-25000SOLDER SPHERES SAC305 DIAMETER 2 Chip Quik Inc. |
3,473 | - |
RFQ |
Datenblatt |
Jar | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.025 (0.64mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
EXB-SN60PB40SOLDER BAR SN60/PB40 1LB (454G) Chip Quik Inc. |
2,818 | - |
RFQ |
Datenblatt |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn60Pb40 (60/40) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - |
|
SMD2SW.031 8OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
2,958 | - |
RFQ |
Datenblatt |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
SMD2SW.020 8OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
3,698 | - |
RFQ |
Datenblatt |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
SMD2040-25000SOLDER SPHERES SAC305 .020 DIAM Chip Quik Inc. |
3,320 | - |
RFQ |
Datenblatt |
Jar | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMDSW.031 8OZSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
2,906 | - |
RFQ |
Datenblatt |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
SMDSW.020 8OZSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
3,760 | - |
RFQ |
Datenblatt |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - |
|
SMD2SWLT.047 2OZSOLDER WIRE SN42/BI57.6/AG0.4 .0 Chip Quik Inc. |
2,409 | - |
RFQ |
Datenblatt |
Bulk | SMD2 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.047 (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
SMDSWLT.047 2OZSOLDER WIRE SN42/BI57/AG1 .047 Chip Quik Inc. |
3,666 | - |
RFQ |
Datenblatt |
Bulk | SMD | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.047 (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
NC2SW.015 4OZSOLDER WIRE 60/40 TIN/LEAD (SN60 Chip Quik Inc. |
3,607 | - |
RFQ |
Datenblatt |
Bulk | CHIPQUIK® | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015 (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
EXB-SN63PB37SOLDER BAR SN63/PB37 1LB (454G) Chip Quik Inc. |
3,930 | - |
RFQ |
Datenblatt |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - |
|
CQ100GE 35GGERMANIUM DOPED SOLDER PASTE NO- Chip Quik Inc. |
3,952 | - |
RFQ |
Datenblatt |
Bulk | - | Active | Solder Paste | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | - | 441°F (227°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD2SWLF.020 8OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,257 | - |
RFQ |
Datenblatt |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020 (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
NC2SW.015 8OZSOLDER WIRE 60/40 TIN/LEAD (SN60 Chip Quik Inc. |
2,066 | - |
RFQ |
Datenblatt |
Bulk | CHIPQUIK® | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015 (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | - | Leaded | Spool, 8 oz (226.80g) | - | - |
|
SMD2SW.031 1LBSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
2,487 | - |
RFQ |
Datenblatt |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
NC2SW.031 1LBSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
2,455 | - |
RFQ |
Datenblatt |
Bulk | - | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
WS991AX35T4THERMALLY STABLE SOLDER PASTE WS Chip Quik Inc. |
2,900 | - |
RFQ |
Datenblatt |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture |
- 1500+ Täglicher Durchschnitts-RFQ
- 20,000.000 Standardprodukteinheit
- 1800+ Weltweite Hersteller
- 15,000+ Lagerbestand
