Sockel für ICs, Transistoren

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-47-306-41-001000

115-47-306-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,225 -

RFQ

115-47-306-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-47-310-41-117000

114-47-310-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,969 -

RFQ

114-47-310-41-117000

Datenblatt

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-210-41-001000

115-47-210-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,936 -

RFQ

115-47-210-41-001000

Datenblatt

Tube 115 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-310-41-001000

614-93-310-41-001000

SOCKET CARRIER LOWPRO .300 10POS

Mill-Max Manufacturing Corp.
2,075 -

RFQ

614-93-310-41-001000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-310-41-001000

614-43-310-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,844 -

RFQ

614-43-310-41-001000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-304-61-001000

115-43-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,996 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-304-61-001000

115-93-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,448 -

RFQ

Tube * Active - - - - - - - - - - - - - -
114-47-210-41-117000

114-47-210-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,560 -

RFQ

114-47-210-41-117000

Datenblatt

Tube 114 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-310-41-001000

612-41-310-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,447 -

RFQ

612-41-310-41-001000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-310-41-001000

612-91-310-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,959 -

RFQ

612-91-310-41-001000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-47-102-41-005000

317-47-102-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.
2,454 -

RFQ

317-47-102-41-005000

Datenblatt

Bulk 317 Active SIP 2 (1 x 2) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-41-308-41-001000

210-41-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,392 -

RFQ

210-41-308-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-308-41-001000

210-91-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,601 -

RFQ

210-91-308-41-001000

Datenblatt

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-310-41-001000

126-93-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,826 -

RFQ

126-93-310-41-001000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-310-41-001000

126-43-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,327 -

RFQ

126-43-310-41-001000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-210-41-008000

116-93-210-41-008000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,808 -

RFQ

116-93-210-41-008000

Datenblatt

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-210-41-008000

116-43-210-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,566 -

RFQ

116-43-210-41-008000

Datenblatt

Tube 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-306-41-001000

115-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,343 -

RFQ

115-41-306-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-306-41-001000

115-91-306-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.
2,489 -

RFQ

115-91-306-41-001000

Datenblatt

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-47-210-41-001000

111-47-210-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,416 -

RFQ

111-47-210-41-001000

Datenblatt

Tube 111 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 4344454647484950...608Next»
Daily average RFQ Volume
1500+ Täglicher Durchschnitts-RFQ
Standard Product Unit
20,000.000 Standardprodukteinheit
Worldwide Manufacturers
1800+ Weltweite Hersteller
In-stock Warehouse
15,000+ Lagerbestand
FudongIC

Startseite

FudongIC

Produkt

+86 075582561136

Telefon

FudongIC

Benutzer