Sockel für ICs, Transistoren

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
124-83-304-41-002101

124-83-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
2,979 -

RFQ

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-103-41-005101

917-83-103-41-005101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip
2,150 -

RFQ

917-83-103-41-005101

Datenblatt

Bulk 917 Active Transistor, TO-5 3 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-103-41-053101

917-83-103-41-053101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip
3,812 -

RFQ

917-83-103-41-053101

Datenblatt

Bulk 917 Active Transistor, TO-5 3 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-306-41-134191

114-83-306-41-134191

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,613 -

RFQ

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-011101

116-83-304-41-011101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,811 -

RFQ

116-83-304-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-001101

110-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,171 -

RFQ

110-83-310-41-001101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-610-41-001101

110-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,419 -

RFQ

110-83-610-41-001101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-310-41-105101

110-87-310-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,583 -

RFQ

110-87-310-41-105101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-310-41-001101

614-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,656 -

RFQ

614-87-310-41-001101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-610-41-001101

614-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,532 -

RFQ

614-87-610-41-001101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-312-01-680101

110-87-312-01-680101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,875 -

RFQ

110-87-312-01-680101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6), 6 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-01-822101

110-87-316-01-822101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,291 -

RFQ

110-87-316-01-822101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8), 4 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-009101

116-87-306-41-009101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,830 -

RFQ

116-87-306-41-009101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-210-01-839101

110-87-210-01-839101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,277 -

RFQ

110-87-210-01-839101

Datenblatt

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5), 8 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-41-605101

110-87-316-41-605101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,646 -

RFQ

110-87-316-41-605101

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-41-005101

110-87-316-41-005101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,545 -

RFQ

110-87-316-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-020-05-001101

510-87-020-05-001101

CONN SOCKET PGA 20POS GOLD

Preci-Dip
3,787 -

RFQ

510-87-020-05-001101

Datenblatt

Bulk 510 Active PGA 20 (5 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-310-41-001101

612-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,227 -

RFQ

612-87-310-41-001101

Datenblatt

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-610-41-001101

612-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,512 -

RFQ

612-87-610-41-001101

Datenblatt

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-012101

116-87-308-41-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,877 -

RFQ

116-87-308-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 678910111213...142Next»
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

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