Rechteck-Steckverbinder – Stiftleisten, Stiftkontakte

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus ConnectorType ContactType Pitch-Mating NumberofPositions NumberofRows RowSpacing-Mating NumberofPositionsLoaded Style Shrouding MountingType Termination FasteningType ContactLength-Mating ContactLength-Post OverallContactLength InsulationHeight ContactShape ContactFinish-Mating ContactFinishThickness-Mating ContactFinish-Post ContactMaterial
850-10-025-10-001101

850-10-025-10-001101

CONN HEADER VERT 25POS 1.27MM

Preci-Dip
1,191 -

RFQ

850-10-025-10-001101

Datenblatt

Tray 850 Active Header Male Pin 0.050 (1.27mm) 25 1 - All Board to Board Unshrouded Through Hole Solder Push-Pull 0.118 (3.00mm) 0.114 (2.90mm) 0.319 (8.10mm) 0.087 (2.20mm) Circular Gold 10.0µin (0.25µm) Gold Brass
850-10-025-20-001101

850-10-025-20-001101

CONN HEADER R/A 25POS 1.27MM

Preci-Dip
3,670 -

RFQ

850-10-025-20-001101

Datenblatt

Tray 850 Active Header Male Pin 0.050 (1.27mm) 25 1 - All Board to Board Unshrouded Through Hole, Right Angle Solder Push-Pull 0.118 (3.00mm) 0.118 (3.00mm) - 0.087 (2.20mm) Circular Gold 10.0µin (0.25µm) Gold Brass
830-10-050-10-001101

830-10-050-10-001101

CONN HEADER VERT 50POS 2MM

Preci-Dip
188 -

RFQ

830-10-050-10-001101

Datenblatt

Bulk 830 Active Header Male Pin 0.079 (2.00mm) 50 1 - All Board to Board Unshrouded Through Hole Solder Push-Pull 0.141 (3.60mm) 0.114 (2.90mm) 0.394 (10.00mm) 0.110 (2.79mm) Circular Gold 10.0µin (0.25µm) Gold Brass
800-10-050-10-001101

800-10-050-10-001101

CONN HEADER VERT 50POS 2.54MM

Preci-Dip
106 -

RFQ

800-10-050-10-001101

Datenblatt

Bulk 800 Active Header Male Pin 0.100 (2.54mm) 50 1 - All Board to Board Unshrouded Through Hole Solder Push-Pull 0.191 (4.85mm) 0.121 (3.08mm) 0.438 (11.12mm) 0.116 (2.95mm) Circular Gold 10.0µin (0.25µm) Gold Brass
800-10-064-10-002101

800-10-064-10-002101

CONN HEADER VERT 64POS 2.54MM

Preci-Dip
123 -

RFQ

800-10-064-10-002101

Datenblatt

Bulk 800 Active Header Male Pin 0.100 (2.54mm) 64 1 - All Board to Board Unshrouded Through Hole Solder Push-Pull 0.141 (3.60mm) 0.118 (3.00mm) 0.385 (9.77mm) 0.116 (2.95mm) Circular Gold 10.0µin (0.25µm) Gold Brass
800-80-064-65-001101

800-80-064-65-001101

CONN HEADER VERT 64POS 2.54MM

Preci-Dip
200 -

RFQ

800-80-064-65-001101

Datenblatt

Bulk 800 Active Header Male Pin 0.100 (2.54mm) 64 1 - All Board to Board Unshrouded Through Hole Press-Fit, Solder Push-Pull 0.191 (4.85mm) 0.110 (2.79mm) 0.427 (10.85mm) 0.116 (2.95mm) Circular Tin - Tin Bronze
350-10-164-00-106101

350-10-164-00-106101

CONN HEADER SMD 64POS 2.54MM

Preci-Dip
237 -

RFQ

350-10-164-00-106101

Datenblatt

Bulk 350 Active Header Male Pin 0.100 (2.54mm) 64 1 - All Board to Board Unshrouded Surface Mount Solder Push-Pull 0.141 (3.60mm) - - 0.116 (2.95mm) Circular Gold 10.0µin (0.25µm) Gold Brass
399-10-164-10-009101

399-10-164-10-009101

CONN HEADER R/A 64POS 2.54MM

Preci-Dip
143 -

RFQ

399-10-164-10-009101

Datenblatt

Bulk 399 Active Header Male Pin 0.100 (2.54mm) 64 1 - All Board to Board Unshrouded Through Hole, Right Angle Solder Push-Pull 0.157 (4.00mm) 0.126 (3.20mm) - 0.100 (2.54mm) Circular Gold 10.0µin (0.25µm) Gold Brass
850-10-050-20-001101

850-10-050-20-001101

CONN HEADER R/A 50POS 1.27MM

Preci-Dip
157 -

RFQ

850-10-050-20-001101

Datenblatt

Tray 850 Active Header Male Pin 0.050 (1.27mm) 50 1 - All Board to Board Unshrouded Through Hole, Right Angle Solder Push-Pull 0.118 (3.00mm) 0.118 (3.00mm) - 0.087 (2.20mm) Circular Gold 10.0µin (0.25µm) Gold Brass
852-10-100-20-001101

852-10-100-20-001101

CONN HEADER R/A 100P 1.27MM

Preci-Dip
192 -

RFQ

852-10-100-20-001101

Datenblatt

Bulk 852 Active Header Male Pin 0.050 (1.27mm) 100 2 0.050 (1.27mm) All Board to Board Unshrouded Through Hole, Right Angle Solder Push-Pull 0.118 (3.00mm) 0.126 (3.20mm) - 0.128 (3.25mm) Circular Gold 10.0µin (0.25µm) Gold Brass
830-80-050-10-001101

830-80-050-10-001101

CONN HEADER VERT 50POS 2MM

Preci-Dip
134 -

RFQ

830-80-050-10-001101

Datenblatt

Bulk 830 Active Header Male Pin 0.079 (2.00mm) 50 1 - All Board to Board Unshrouded Through Hole Solder Push-Pull 0.141 (3.60mm) 0.114 (2.90mm) 0.394 (10.00mm) 0.110 (2.79mm) Circular Tin - Tin Brass
850-80-050-40-001101

850-80-050-40-001101

CONN HEADER SMD R/A 50POS 1.27MM

Preci-Dip
849 -

RFQ

850-80-050-40-001101

Datenblatt

Bulk 850 Active Header Male Pin 0.050 (1.27mm) 50 1 - All Board to Board Unshrouded Surface Mount, Right Angle Solder Push-Pull 0.118 (3.00mm) - - 0.087 (2.20mm) Circular Tin - Tin Brass
802-80-072-30-001101

802-80-072-30-001101

CONN HEADER SMD 72POS 2.54MM

Preci-Dip
109 -

RFQ

802-80-072-30-001101

Datenblatt

Bulk 802 Active Header Male Pin 0.100 (2.54mm) 72 2 0.100 (2.54mm) All Board to Board Unshrouded Surface Mount Solder Push-Pull 0.191 (4.85mm) - - 0.110 (2.79mm) Circular Tin - Tin Brass
802-10-072-30-001101

802-10-072-30-001101

CONN HEADER SMD 72POS 2.54MM

Preci-Dip
162 -

RFQ

802-10-072-30-001101

Datenblatt

Bulk 802 Active Header Male Pin 0.100 (2.54mm) 72 2 0.100 (2.54mm) All Board to Board Unshrouded Surface Mount Solder Push-Pull 0.191 (4.85mm) - - 0.110 (2.79mm) Circular Gold 10.0µin (0.25µm) Gold Brass
894-70-009-10-001101

894-70-009-10-001101

CONN HEADER VERT 9POS 2.54MM

Preci-Dip
1,500 -

RFQ

894-70-009-10-001101

Datenblatt

Bulk 894 Active Header Male Pin 0.100 (2.54mm) 9 3 0.100 (2.54mm) All Board to Board Unshrouded Through Hole Solder Push-Pull 0.236 (6.00mm) 0.122 (3.10mm) 0.458 (11.64mm) 0.100 (2.54mm) Square Gold Flash Gold Brass
832-10-004-30-001191

832-10-004-30-001191

CONN HEADER SMD 4POS 2MM

Preci-Dip
1,061 -

RFQ

Tape & Reel (TR),Cut Tape (CT) 832 Active Header Male Pin 0.079 (2.00mm) 4 2 0.079 (2.00mm) All Board to Board Unshrouded Surface Mount Solder Push-Pull 0.141 (3.60mm) - - 0.110 (2.79mm) Circular Gold 10.0µin (0.25µm) Gold Brass
892-18-012-20-001101

892-18-012-20-001101

CONN HEADER R/A 12POS 2.54MM

Preci-Dip
4,048 -

RFQ

892-18-012-20-001101

Datenblatt

Bulk 892 Active Header Male Pin 0.100 (2.54mm) 12 2 0.100 (2.54mm) All Board to Board Unshrouded Through Hole, Right Angle Solder Push-Pull 0.236 (6.00mm) 0.118 (3.00mm) - 0.200 (5.08mm) Square Gold 10.0µin (0.25µm) Tin Brass
892-18-040-10-001101

892-18-040-10-001101

CONN HEADER VERT 40POS 2.54MM

Preci-Dip
249 -

RFQ

892-18-040-10-001101

Datenblatt

Bulk 892 Active Header Male Pin 0.100 (2.54mm) 40 2 0.100 (2.54mm) All Board to Board Unshrouded Through Hole Solder Push-Pull 0.236 (6.00mm) 0.122 (3.10mm) 0.458 (11.64mm) 0.100 (2.54mm) Square Gold 10.0µin (0.25µm) Tin Brass
450-10-248-00-001101

450-10-248-00-001101

CONN HEADER VERT 48POS 2.54MM

Preci-Dip
5,165 -

RFQ

450-10-248-00-001101

Datenblatt

Bulk 450 Active Header Male Pin 0.100 (2.54mm) 48 2 0.100 (2.54mm) All Board to Board Unshrouded Through Hole Solder Push-Pull 0.156 (3.96mm) 0.164 (4.17mm) 0.477 (12.12mm) 0.110 (2.79mm) Circular Gold 10.0µin (0.25µm) Gold Brass
350-80-120-00-001101

350-80-120-00-001101

CONN HEADER VERT 20POS 2.54MM

Preci-Dip
463 -

RFQ

Bulk 350 Active Header Male Pin 0.100 (2.54mm) 20 1 - All Board to Board Unshrouded Through Hole Solder Push-Pull 0.156 (3.96mm) 0.164 (4.17mm) 0.477 (12.12mm) 0.110 (2.79mm) Circular Tin - Tin Brass
Total 120 Record«Prev123456Next»
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

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Fudong Communication (shenzhen) Group Co., Ltd.

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Fudong Communication (shenzhen) Group Co., Ltd.

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