PMIC – Energiemanagement – ​​Spezialisiert

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Applications Current-Supply Voltage-Supply OperatingTemperature MountingType
MC35FS4501CAE

MC35FS4501CAE

FS4500

NXP USA Inc.
2,277 -

RFQ

MC35FS4501CAE

Datenblatt

Tray Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
MC33PF8201A0ESR2

MC33PF8201A0ESR2

POWER MANAGEMENT IC I.MX8 NON-PR

NXP USA Inc.
2,626 -

RFQ

MC33PF8201A0ESR2

Datenblatt

Tape & Reel (TR) - Active High Performance i.MX 8 Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) Surface Mount, Wettable Flank
MC33FS8530A1ESR2

MC33FS8530A1ESR2

SYSTEM BASIS CHIP FS8500

NXP USA Inc.
2,301 -

RFQ

Tape & Reel (TR) * Active - - - - -
MC33FS8530A4ESR2

MC33FS8530A4ESR2

SYSTEM BASIS CHIP FS8530

NXP USA Inc.
3,628 -

RFQ

Tape & Reel (TR) * Active - - - - -
MC33FS8530A0ESR2

MC33FS8530A0ESR2

SYSTEM BASIS CHIP FS8500

NXP USA Inc.
3,236 -

RFQ

Tape & Reel (TR) * Active - - - - -
MC35FS6501CAE

MC35FS6501CAE

FS6500

NXP USA Inc.
3,297 -

RFQ

MC35FS6501CAE

Datenblatt

Tray Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
MC35FS6503NAER2

MC35FS6503NAER2

FS6500

NXP USA Inc.
2,775 -

RFQ

MC35FS6503NAER2

Datenblatt

Tape & Reel (TR) Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
MC33FS6504LAE

MC33FS6504LAE

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.
3,984 -

RFQ

MC33FS6504LAE

Datenblatt

Tray - Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C Surface Mount
MC34FS6407NAE

MC34FS6407NAE

IC SYSTEM BASIS CHIP CAN 48LQFP

NXP USA Inc.
500 -

RFQ

MC34FS6407NAE

Datenblatt

Bulk,Tray - Active System Basis Chip 13mA 2.7V ~ 36V -40°C ~ 125°C Surface Mount
MWCT1213VLL

MWCT1213VLL

32BIT 256K FLASH

NXP USA Inc.
3,594 -

RFQ

Tray * Active - - - - -
MC35FS4502CAE

MC35FS4502CAE

FS4500

NXP USA Inc.
2,018 -

RFQ

MC35FS4502CAE

Datenblatt

Tray Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
MC35FS6502CAE

MC35FS6502CAE

FS6500

NXP USA Inc.
3,307 -

RFQ

MC35FS6502CAE

Datenblatt

Tray Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
MC33PF8100CCESR2

MC33PF8100CCESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.
2,483 -

RFQ

MC33PF8100CCESR2

Datenblatt

Tape & Reel (TR) - Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) Surface Mount, Wettable Flank
MC33PF8100EPESR2

MC33PF8100EPESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.
2,494 -

RFQ

MC33PF8100EPESR2

Datenblatt

Tape & Reel (TR) - Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) Surface Mount, Wettable Flank
MC33PF8100CFESR2

MC33PF8100CFESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.
3,019 -

RFQ

MC33PF8100CFESR2

Datenblatt

Tape & Reel (TR) - Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) Surface Mount, Wettable Flank
MC33PF8100EQESR2

MC33PF8100EQESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.
3,615 -

RFQ

MC33PF8100EQESR2

Datenblatt

Tape & Reel (TR) - Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) Surface Mount, Wettable Flank
MC33PF8100EAESR2

MC33PF8100EAESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.
3,018 -

RFQ

MC33PF8100EAESR2

Datenblatt

Tape & Reel (TR) - Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) Surface Mount, Wettable Flank
MC33PF8100CHESR2

MC33PF8100CHESR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.
2,243 -

RFQ

MC33PF8100CHESR2

Datenblatt

Tape & Reel (TR) - Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) Surface Mount, Wettable Flank
MC33FS6514LAE

MC33FS6514LAE

SYSTEM BASIS CHIP DCDC 1.5A VCO

NXP USA Inc.
2,162 -

RFQ

MC33FS6514LAE

Datenblatt

Tray - Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C Surface Mount
MC35FS6511CAE

MC35FS6511CAE

FS6500

NXP USA Inc.
2,081 -

RFQ

MC35FS6511CAE

Datenblatt

Tray Automotive, AEC-Q100 Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Surface Mount
Total 716 Record«Prev1... 2526272829303132...36Next»
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

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Fudong Communication (shenzhen) Group Co., Ltd.

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Fudong Communication (shenzhen) Group Co., Ltd.

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