Schnittstellen – Sensor- und Detektorschnittstellen

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Package/Case Packaging Series ProductStatus Type InputType OutputType Current-Supply OperatingTemperature MountingType
ZSSC3154BE1D

ZSSC3154BE1D

DICE (WAFER SAWN) - WAFFLE PACK

IDT, Integrated Device Technology Inc
3,871 -

RFQ

ZSSC3154BE1D

Datenblatt

- Tray * Active - - - - - -
ZSSC3170EA1B

ZSSC3170EA1B

WAFER (UNSAWN) - BOX

IDT, Integrated Device Technology Inc
2,658 -

RFQ

ZSSC3170EA1B

Datenblatt

- Tray * Active - - - - - -
ZSSC3170EA1C

ZSSC3170EA1C

DICE (WAFER SAWN) - FRAME

IDT, Integrated Device Technology Inc
3,676 -

RFQ

ZSSC3170EA1C

Datenblatt

- Tray * Active - - - - - -
ZSSC3170EA1D

ZSSC3170EA1D

DICE (WAFER SAWN) - WAFFLE PACK

IDT, Integrated Device Technology Inc
2,408 -

RFQ

ZSSC3170EA1D

Datenblatt

- Tray * Active - - - - - -
ZSSC3170EE1B

ZSSC3170EE1B

WAFER (UNSAWN) - BOX

IDT, Integrated Device Technology Inc
3,011 -

RFQ

ZSSC3170EE1B

Datenblatt

- Tray * Active - - - - - -
ZSSC3170EE1C

ZSSC3170EE1C

DICE (WAFER SAWN) - FRAME

IDT, Integrated Device Technology Inc
3,830 -

RFQ

ZSSC3170EE1C

Datenblatt

- Tray * Active - - - - - -
ZSSC3170EE1D

ZSSC3170EE1D

DICE (WAFER SAWN) - WAFFLE PACK

IDT, Integrated Device Technology Inc
2,118 -

RFQ

ZSSC3170EE1D

Datenblatt

- Tray * Active - - - - - -
ZSSC3170FE1B

ZSSC3170FE1B

WAFER (UNSAWN) - BOX

IDT, Integrated Device Technology Inc
3,102 -

RFQ

ZSSC3170FE1B

Datenblatt

- Tray * Active - - - - - -
ZSSC3170FE1C

ZSSC3170FE1C

DICE (WAFER SAWN) - FRAME

IDT, Integrated Device Technology Inc
3,154 -

RFQ

ZSSC3170FE1C

Datenblatt

- Tray * Active - - - - - -
ZSSC3218BI1B ES

ZSSC3218BI1B ES

WAFER (UNSAWN) - BOX

IDT, Integrated Device Technology Inc
2,466 -

RFQ

ZSSC3218BI1B ES

Datenblatt

- Tray * Active - - - - - -
ZSSC3218BI1C

ZSSC3218BI1C

DICE (WAFER SAWN) - FRAME

IDT, Integrated Device Technology Inc
2,865 -

RFQ

ZSSC3218BI1C

Datenblatt

- Tray * Active - - - - - -
ZSSC3218BI1D ES

ZSSC3218BI1D ES

DICE (WAFER SAWN) - WAFFLE PACK

IDT, Integrated Device Technology Inc
2,930 -

RFQ

ZSSC3218BI1D ES

Datenblatt

- Tray * Active - - - - - -
ZSSC3224BI1B ES

ZSSC3224BI1B ES

WAFER (UNSAWN) - BOX

IDT, Integrated Device Technology Inc
2,054 -

RFQ

ZSSC3224BI1B ES

Datenblatt

- Tray * Active - - - - - -
ZSSC3224BI1D ES

ZSSC3224BI1D ES

DICE (WAFER SAWN) - WAFFLE PACK

IDT, Integrated Device Technology Inc
3,478 -

RFQ

ZSSC3224BI1D ES

Datenblatt

- Tray * Active - - - - - -
ZSSC4151AE1B

ZSSC4151AE1B

WAFER (UNSAWN) - BOX

IDT, Integrated Device Technology Inc
3,228 -

RFQ

ZSSC4151AE1B

Datenblatt

- Tray * Active - - - - - -
ZSSC4151AE1C

ZSSC4151AE1C

DICE (WAFER SAWN) - FRAME

IDT, Integrated Device Technology Inc
3,708 -

RFQ

ZSSC4151AE1C

Datenblatt

- Tray * Active - - - - - -
ZSSC4161BE1B

ZSSC4161BE1B

WAFER (UNSAWN) - BOX

IDT, Integrated Device Technology Inc
2,857 -

RFQ

- Tray * Active - - - - - -
ZSSC4161BE1C

ZSSC4161BE1C

DICE (WAFER SAWN) - FRAME

IDT, Integrated Device Technology Inc
3,161 -

RFQ

- Tray * Active - - - - - -
ZSSC4162BE1B

ZSSC4162BE1B

WAFER (UNSAWN) - BOX

IDT, Integrated Device Technology Inc
3,234 -

RFQ

- Tray * Active - - - - - -
ZSSC4162BE1C

ZSSC4162BE1C

DICE (WAFER SAWN) - FRAME

IDT, Integrated Device Technology Inc
2,685 -

RFQ

- Tray * Active - - - - - -
Total 156 Record«Prev12345678Next»
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

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Fudong Communication (shenzhen) Group Co., Ltd.

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Fudong Communication (shenzhen) Group Co., Ltd.

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