Wärmetechnik – Klebstoffe, Epoxidharze, Fette, Pasten

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type Size/Dimension UsableTemperatureRange Color ThermalConductivity Features ShelfLife
TC3-10G

TC3-10G

HEAT SINK THERMAL COMPOUND

Chip Quik Inc.
102 -

RFQ

TC3-10G

Datenblatt

Bulk CHIPQUIK® Active Silicone Compound 10 gram Syringe -40°F ~ 302°F (-40°C ~ 150°C) Gray 8.50W/m-K - 60 Months
TC3-1G

TC3-1G

HEAT SINK THERMAL COMPOUND

Chip Quik Inc.
2,683 -

RFQ

TC3-1G

Datenblatt

Bulk CHIPQUIK® Active Silicone Compound 1 gram Syringe -40°F ~ 302°F (-40°C ~ 150°C) Gray 8.50W/m-K - 60 Months
TC1-10G

TC1-10G

HEAT SINK COMPOUND - HIGH DENSIT

Chip Quik Inc.
3,397 -

RFQ

TC1-10G

Datenblatt

Bulk - Active Silicone Compound 10 gram Syringe - White 0.67W/m-K - 60 Months
TC2-10G

TC2-10G

HEAT SINK COMPOUND - GREY ULTRA

Chip Quik Inc.
3,495 -

RFQ

TC2-10G

Datenblatt

Bulk - Active Silicone Compound 10 gram Syringe -40°F ~ 302°F (-40°C ~ 150°C) Gray 4.30W/m-K - 24 Months
TC4-10G

TC4-10G

HEAT SINK THERMAL COMPOUND - DEE

Chip Quik Inc.
3,492 -

RFQ

TC4-10G

Datenblatt

Bulk CHIPQUIK® Active Silicone Compound 10 gram Syringe -40°F ~ 302°F (-40°C ~ 150°C) Silver 79.00 W/m-K - 60 Months
TC2-20G

TC2-20G

HEAT SINK COMPOUND - GREY ULTRA

Chip Quik Inc.
3,076 -

RFQ

TC2-20G

Datenblatt

Bulk - Active Silicone Compound 20 gram Syringe -40°F ~ 302°F (-40°C ~ 150°C) Gray 4.30W/m-K - 24 Months
TC1-200G

TC1-200G

HEAT SINK COMPOUND - HIGH DENSIT

Chip Quik Inc.
3,281 -

RFQ

TC1-200G

Datenblatt

Bulk - Active Silicone Compound 200 gram Jar - White 0.67W/m-K - 60 Months
TC4-20G

TC4-20G

HEAT SINK THERMAL COMPOUND - DEE

Chip Quik Inc.
3,098 -

RFQ

TC4-20G

Datenblatt

Bulk CHIPQUIK® Active Silicone Compound 20 gram Syringe -40°F ~ 302°F (-40°C ~ 150°C) Silver 79.00 W/m-K - 60 Months
TC2-50G

TC2-50G

HEAT SINK COMPOUND - GREY ULTRA

Chip Quik Inc.
2,214 -

RFQ

TC2-50G

Datenblatt

Bulk - Active Silicone Compound 50 gram Jar -40°F ~ 302°F (-40°C ~ 150°C) Gray 4.30W/m-K - 24 Months
TC4-1G

TC4-1G

HEAT SINK THERMAL COMPOUND - DEE

Chip Quik Inc.
2,135 -

RFQ

TC4-1G

Datenblatt

Bulk CHIPQUIK® Active Silicone Compound 1 gram Syringe -40°F ~ 302°F (-40°C ~ 150°C) Silver 79.00 W/m-K - 60 Months
TC4-2G

TC4-2G

HEAT SINK THERMAL COMPOUND - DEE

Chip Quik Inc.
2,244 -

RFQ

TC4-2G

Datenblatt

Bulk CHIPQUIK® Active Silicone Compound 2 gram Syringe -40°F ~ 302°F (-40°C ~ 150°C) Silver 79.00 W/m-K - 60 Months
TC4-5G

TC4-5G

HEAT SINK THERMAL COMPOUND - DEE

Chip Quik Inc.
3,535 -

RFQ

TC4-5G

Datenblatt

Bulk - Active Silicone Compound 5 gram Syringe -40°F ~ 302°F (-40°C ~ 150°C) Silver 79.00 W/m-K - 60 Months
TC1-20G

TC1-20G

HEAT SINK COMPOUND - HIGH DENSIT

Chip Quik Inc.
3,952 -

RFQ

TC1-20G

Datenblatt

Bulk - Active Silicone Compound 20 gram Syringe - White 0.67W/m-K - 60 Months
TC3-3.5G

TC3-3.5G

HEAT SINK THERMAL COMPOUND

Chip Quik Inc.
3,320 -

RFQ

TC3-3.5G

Datenblatt

Bulk CHIPQUIK® Active Silicone Compound 3.5 gram Syringe -40°F ~ 302°F (-40°C ~ 150°C) Gray 8.50W/m-K - 60 Months
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

Benutzer