Sockel für ICs, Transistoren

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
382

382

CONN IC DIP SOCKET 28POS

Adafruit Industries LLC
2,998 -

RFQ

382

Datenblatt

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) - - - - - - - - - - - -
383

383

40-PIN ZIF SOCKET

Adafruit Industries LLC
3,158 -

RFQ

383

Datenblatt

- - Active DIP, ZIF (ZIP) 40 (2 x 20) - Gold - - Through Hole Closed Frame Solder - Gold - - -
4726

4726

SMT SOCKET - WIDE SOIC-8 (200MIL

Adafruit Industries LLC
3,569 -

RFQ

4726

Datenblatt

Bulk - Active SOIC 8 (2 x 4) 0.050 (1.27mm) - - - Surface Mount Closed Frame Solder 0.050 (1.27mm) - - - -
4727

4727

SMT SOCKET - WIDE SOIC-16

Adafruit Industries LLC
2,549 -

RFQ

4727

Datenblatt

Bulk - Active SOIC 16 (2 x 8) 0.050 (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 100.0µin (2.54µm) Copper Alloy Thermoplastic
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

Benutzer