Sockel für ICs, Transistoren

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
TDU03DTON

TDU03DTON

CONN SOCKET TRANSIST 3POS GOLD

Sullins Connector Solutions
893 -

RFQ

TDU03DTON

Datenblatt

Tray - Active Transistor 3 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
TDU03DTOD

TDU03DTOD

CONN SOCKET TRANSIST 3POS GOLD

Sullins Connector Solutions
110 -

RFQ

TDU03DTOD

Datenblatt

Tray - Active Transistor 3 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide, Flange Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
MPP-1100-05-DS-4GR(S1402)

MPP-1100-05-DS-4GR(S1402)

CONN TRANSIST TO-220/TO-247 5POS

Sullins Connector Solutions
2,906 -

RFQ

MPP-1100-05-DS-4GR(S1402)

Datenblatt

Tray - Active Transistor, TO-220 and TO-247 5 (Rectangular) - Gold 30.0µin (0.76µm) Nickel Boron Through Hole, Right Angle - Solder - Gold 30.0µin (0.76µm) Nickel Boron Polyphenylene Sulfide (PPS)
FMC05DRTN-S1682

FMC05DRTN-S1682

CONN TRANSIST TO-220/TO-247 5POS

Sullins Connector Solutions
2,681 -

RFQ

FMC05DRTN-S1682

Datenblatt

Tray - Active Transistor, TO-220 and TO-247 5 (Rectangular) - Gold 30.0µin (0.76µm) Nickel Boron Through Hole - Solder - Gold 30.0µin (0.76µm) Nickel Boron Polyphenylene Sulfide (PPS)
TCC05DCSN-S1403

TCC05DCSN-S1403

CONN TRANSIST TO-220/TO-247 5POS

Sullins Connector Solutions
3,473 -

RFQ

TCC05DCSN-S1403

Datenblatt

Tray - Active Transistor, TO-220 and TO-247 5 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
TCC03DKSN-S1713

TCC03DKSN-S1713

CONN TRANSIST TO-262 3POS GOLD

Sullins Connector Solutions
2,897 -

RFQ

TCC03DKSN-S1713

Datenblatt

Tray - Active Transistor, TO-262 3 (Rectangular) 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
TMJ03DKSD-S1512

TMJ03DKSD-S1512

CONN TRANSIST TO-254 3POS GOLD

Sullins Connector Solutions
2,719 -

RFQ

TMJ03DKSD-S1512

Datenblatt

Tray - Active Transistor, TO-254 3 (Rectangular) 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Flange Solder 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
ASU02DXTB

ASU02DXTB

CONN SOCKET AXIAL 2POS GOLD

Sullins Connector Solutions
3,688 -

RFQ

Tray - Obsolete Axial 2 (Rectangular) - Gold 10.0µin (0.25µm) - Through Hole Board Guide Solder - Gold 10.0µin (0.25µm) - -
TDU02DXTB

TDU02DXTB

TEST SOCKET

Sullins Connector Solutions
3,464 -

RFQ

Bulk - Active Axial 2 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide Solder 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

Benutzer