Sockel für ICs, Transistoren

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
8114LB603G

8114LB603G

HEATSINK

Aavid, Thermal Division of Boyd Corporation
2,246 -

RFQ

- - Active - - - - - - - - - - - - - -
8114LB603 REV J

8114LB603 REV J

CONN TRANSIST TO-3 4POS TIN

Aavid, Thermal Division of Boyd Corporation
3,383 -

RFQ

8114LB603 REV J

Datenblatt

Bulk 8180 Active Transistor, TO-3 4 (Oval) - Tin - Brass Through Hole Closed Frame Solder - Tin - Brass Phenolic
8180-E1

8180-E1

CONN TRANSIST TO-3 4POS TIN

Aavid, Thermal Division of Boyd Corporation
3,640 -

RFQ

8180-E1

Datenblatt

Bulk 8180 Active Transistor, TO-3 4 (Oval) - Tin - Steel Through Hole Closed Frame Solder - Tin - Steel Polyamide (PA), Nylon, Glass Filled
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

Benutzer