Sockel für ICs, Transistoren – Adapter

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus ConvertFrom(AdapterEnd) ConvertTo(AdapterEnd) NumberofPins Pitch-Mating ContactFinish-Mating MountingType Termination Pitch-Post ContactFinish-Post HousingMaterial
PA-SOD6SM18-40

PA-SOD6SM18-40

ADAPTER 40SOIC TO 40DIP

Logical Systems Inc.
2,146 -

RFQ

PA-SOD6SM18-40

Datenblatt

Bulk - Active SOIC DIP, 0.6 (15.24mm) Row Spacing 40 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) - -
PA-TS1D6SM18-40

PA-TS1D6SM18-40

ADAPTER 40TSOP TO 40DIP

Logical Systems Inc.
2,603 -

RFQ

PA-TS1D6SM18-40

Datenblatt

Bulk - Active TSOP DIP 40 0.020 (0.50mm) - Through Hole Solder 0.100 (2.54mm) - -
PA-SOD6SM18-44

PA-SOD6SM18-44

ADAPTER 44SOIC TO 44DIP

Logical Systems Inc.
2,984 -

RFQ

PA-SOD6SM18-44

Datenblatt

Bulk - Active SOIC DIP 44 0.050 (1.27mm) - Through Hole Solder 0.100 (2.54mm) - -
PA-TS1D6SM18-56

PA-TS1D6SM18-56

ADAPTER 56TSOP TO 56DIP

Logical Systems Inc.
3,581 -

RFQ

PA-TS1D6SM18-56

Datenblatt

Bulk - Active TSOP DIP 56 0.020 (0.50mm) - Through Hole Solder 0.100 (2.54mm) - -
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

Benutzer