Gehäuse für Evaluierungs- und Entwicklungsboards

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus ContainerType Platform Size/Dimension Height Area(LxW) Design Material Color Thickness Features
ASBC2RPI4

ASBC2RPI4

HEATSINK ENCLOSURE FOR RASPBERRY

AppliedSBC Systems
2,007 -

RFQ

ASBC2RPI4

Datenblatt

Retail Package - Active Case Raspberry Pi 4 3.456 L x 2.315 W (87.80mm x 58.80mm) 0.640 (16.23mm) - Hand Held, Split Sides Metal, Aluminum Matte Black - Mounting Screws, Rubber Grip Pad
ASBC1RPI4

ASBC1RPI4

HEATSINK ENCLOSURE FOR RASPBERRY

AppliedSBC Systems
3,089 -

RFQ

ASBC1RPI4

Datenblatt

Retail Package - Active Case Raspberry Pi 4 3.456 L x 2.315 W (87.80mm x 58.80mm) 0.640 (16.23mm) - Hand Held, Split Sides Metal, Aluminum Brushed Nickel - Mounting Screws, Rubber Grip Pad
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

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