Audio – Spezialanwendungen

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Package/Case Packaging Series Product Status Function Applications Number of Channels Interface Voltage-Supply Operating Temperature Specifications Mounting Type
XVF3510-QF60-C

XVF3510-QF60-C

IC VPU VOCALFUSION VOICE 60QFN

XMOS
2,545 -

RFQ

XVF3510-QF60-C

Datenblatt

60-VFQFN Exposed Pad Tray - Active Voice Processing Unit (VPU) Far Field Voice Conferencing 2 I²C, I²S, PDM, QSPI, SPI, USB 0.95V ~ 1.05V 0°C ~ 70°C (TA) - Surface Mount
XHRA-2HPA-TQ64-C

XHRA-2HPA-TQ64-C

IC AUDIO SIGNAL PROCESSOR 64TQFP

XMOS
3,537 -

RFQ

XHRA-2HPA-TQ64-C

Datenblatt

64-TQFP Exposed Pad Tray - Obsolete Audio Signal Processor Audio Systems 2 I²C, I²S 3.3V 0°C ~ 70°C (TA) USB Surface Mount
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

Startseite

Fudong Communication (shenzhen) Group Co., Ltd.

Produkt

Fudong Communication (shenzhen) Group Co., Ltd.

Telefon

Fudong Communication (shenzhen) Group Co., Ltd.

Benutzer