Adapter, Breakout-Boards

Foto: Hersteller-Teilenummer Verfügbarkeit Preis Menge Datenblatt Packaging Series ProductStatus ProtoBoardType PackageAccepted NumberofPositions Pitch BoardThickness Material
319010042

319010042

QFP SURFACE MOUNT PROTOBOARD 0.8

Seeed Technology Co., Ltd
2,363 -

RFQ

319010042

Datenblatt

Bulk - Obsolete SMD to Plated Through Hole Board SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP 6, 8 0.020 (0.50mm) - -
319010352

319010352

XQFP BREAKOUT BOARD 0.5MM

Seeed Technology Co., Ltd
2,437 -

RFQ

319010352

Datenblatt

Bulk - Obsolete SMD to Plated Through Hole Board QFP 80 0.020 (0.50mm) - -
319010045

319010045

XQFP BREAKOUT BOARD 0.65MM

Seeed Technology Co., Ltd
3,099 -

RFQ

319010045

Datenblatt

Bulk - Obsolete SMD to Plated Through Hole Board QFP 80 0.026 (0.65mm) - -
319010351

319010351

XQFP BREAKOUT BOARD 0.8MM

Seeed Technology Co., Ltd
2,185 -

RFQ

319010351

Datenblatt

Bulk - Obsolete SMD to Plated Through Hole Board QFP 80 0.031 (0.80mm) - -
319010047

319010047

QFP SURFACE MOUNT PROTOBOARD 0.5

Seeed Technology Co., Ltd
3,626 -

RFQ

319010047

Datenblatt

Bulk - Obsolete SMD to Plated Through Hole Board SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP 6, 8 0.020 (0.50mm) - -
319010053

319010053

QFP SURFACE MOUNT PROTOBOARD 0.6

Seeed Technology Co., Ltd
3,575 -

RFQ

319010053

Datenblatt

Bulk - Obsolete SMD to Plated Through Hole Board SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP 6, 8 0.026 (0.65mm) - -
1500+
1500+ Täglicher Durchschnitts-RFQ
20,000.000
20,000.000 Standardprodukteinheit
1800+
1800+ Weltweite Hersteller
15,000+
15,000+ Lagerbestand
Fudong Communication (shenzhen) Group Co., Ltd.

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Fudong Communication (shenzhen) Group Co., Ltd.

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Fudong Communication (shenzhen) Group Co., Ltd.

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